High Density Interconnects Support IoT Devices
High density interconnects are the foundation of IoT devices. Without their ability to provide proper functionality and flexibility in tiny areas, smart IoT products would not be possible. With their ability to withstand dynamic stress, flexing and bending, HDI PCBs are perfect for IoT products such as wearables, sensors and wireless communication.
IoT devices have incredibly specific requirements for their circuit boards. They need to resist flexing and bending, while ensuring that the data they transmit is accurate. To achieve this, PCB designers need to ensure the highest possible signal integrity in these tiny spaces. This is only possible through the strategic placement of tracks, vias and components that can withstand these physical conditions. This is why both rigid-flex and HDI PCBs are so crucial for IoT products.
Dense component placement: high density interconnect PCBs offer tinier trace widths and superior wiring density, thanks to blind or buried vias and microvias. This helps to save space and create a cleaner circuit route. This, in turn, enables better performance for the devices that will use them.
How Do High Density Interconnects Support IoT Devices?
Power efficiency: IoT devices are constantly in communication with each other, requiring their PCBs to have precise energy management. This means that they need to be able to handle the power that they consume throughout their entire task cycle, from sending and receiving data to operating in standby mode.
Achieving this requires a highly specialized manufacturing process. Only an experienced manufacturer can guarantee the necessary performance. This is why Sierra Assembly Technology offers both rigid-flex and HDI PCBs to its clients, helping them meet the demands of IoT devices.
Thermal security: HDI PCBs feature a unique design, allowing them to disperse heat evenly across their surface. This ensures that the increased component count will not negatively impact the device’s functioning, even in demanding environments.
Enhanced functioning: With a higher density of interconnections and heightened functionality, HDI PCBs are the ideal choice for IoT applications. This is especially true for those that require speedy data transmission and upgraded electronic device functioning. Simplifies wiring: Flexible PCBs are perfect for IoT applications because they eliminate the need for bulky wire harnesses. By doing this, they reduce the amount of soldering and wire wrapping that is required, which in turn reduces the likelihood of errors.
With all these benefits, it’s no wonder that IoT devices are relying on PCB technologies like high density interconnects to make them work the way they do. Contact us today to learn more about how we can support your IoT application with our advanced PCB solutions. We look forward to speaking with you!
